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Mijing ZT-138/150/183/199/217℃ Solder Paste Syringe Flux for SMD BGA IC PCB Needle Tube Tin Paste Welding Cream

MijingSKU: IPG-RT-00567-01

Mijing ZT-138/150/183/199/217℃ Solder Paste Syringe Flux for SMD BGA IC PCB Needle Tube Tin Paste Welding Cream. Heat resistance: up to 217 °C; Application: Mobile phone, tablet and computer repair; Option: What you receive.

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Brand
Mijing
Phone model
SMD BGA IC PCB Needle Tube Tin Paste Welding Cream
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About this item

Mijing ZT-138/150/183/199/217℃ Solder Paste Syringe Flux for SMD BGA IC PCB Needle Tube Tin Paste Welding Cream.

Product details

Heat resistance
up to 217 °C
Application
Mobile phone, tablet and computer repair
Option
What you receive
138 Degree
138 Degree option
150 Degree
150 Degree option
183Degree
183Degree option
199 Degree
199 Degree option
217 Degree
217 Degree option
Compatibility
SMD BGA IC PCB Needle Tube Tin Paste Welding Cream
Available option
138 Degree; 150 Degree; 183Degree; 199 Degree; 217 Degree

Specifications

Heat resistance
up to 217 °C
Application
Mobile phone, tablet and computer repair
Option
What you receive
138 Degree
138 Degree option
150 Degree
150 Degree option
183Degree
183Degree option
199 Degree
199 Degree option
217 Degree
217 Degree option
Compatibility
SMD BGA IC PCB Needle Tube Tin Paste Welding Cream
Available option
138 Degree; 150 Degree; 183Degree; 199 Degree; 217 Degree

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